SMT process engineer

1. Responsible for the formulation, optimization and continuous improvement of SMT (Surface Mount Technology) production process.

2. Prepare SMT related operating instructions (SOP), process parameter settings and FMEA analysis.

3. Monitor the process parameters of reflow soldering, printing, SMT, AOI, SPI and other equipment to ensure process stability.

4. Analyze and solve yield problems in SMT production (such as virtual soldering, offset, bridging, etc.).

5. Responsible for the process design and optimization of back-end assembly (DIP, hand welding, testing, packaging, etc.).

6. Solve problems such as structural assembly, welding quality, and functional testing that arise during the assembly process.

7. Cooperate with new product introduction (NPI) to complete trial production verification and process feasibility assessment.

8. Collaborate with research and development (RD), quality (QA), production, equipment and other departments to promote product design for manufacturability (DFM).

9. Support the analysis and improvement of customer complaints and provide technical support from a process perspective.

10. Promote automation and lean production to improve production efficiency and product yield.

11. Reduce material loss and repair rate, and control manufacturing costs.

More than 1.5 years of experience in SMT and electronic assembly process engineering.

2. Familiar with SMT core processes: solder paste printing, SMT, reflow soldering, AOI/SPI testing, etc.

3. Familiar with DIP processes such as wave soldering and hand soldering.

4. Master common defect analysis methods (such as X-ray, microscope analysis), and be familiar with IPC standards.

5. Proficient in using CAD, CAM and MES systems, and able to understand PCB drawings, assembly drawings and BOM.

6. Familiar with FMEA, SPC, 8D and other quality tools.