DIP process engineer

1. Responsible for the formulation, optimization and continuous improvement of DIP (plug-in) production process, with the core goal of improving the first pass rate of assembly.

2. Prepare DIP related operating instructions (SOP), process parameter settings and FMEA analysis to ensure the accuracy and enforceability of process documents.

3. Monitor process parameters of wave soldering, hand soldering, crimping, depaneling, three-proof coating and other equipment to ensure process stability and consistency.

4. Analyze and solve yield problems in DIP production (such as continuous soldering, missing soldering, empty soldering, floating components, reverse polarity, tin beads, etc.).

5. Responsible for the process design and optimization of back-end assembly (testing, packaging, machine assembly, etc.).

6. Solve problems such as structural assembly, welding quality, and functional testing that arise during the assembly process.

7. Cooperate with new product introduction (NPI) to complete the A and B phase installation review and process feasibility assessment.

8. Collaborate with research and development (RD), quality (QA), production, equipment and other departments to promote product design for manufacturability (DFM).

9. Support the analysis and improvement of customer complaints and provide technical support from a process perspective.

10. Promote automation and lean production to improve production efficiency and product yield. Reduce material loss and repair rate, and control manufacturing costs.

11. Responsible for the promotion and implementation of process routes, management of key positions, training of multi-skilled workers, and skill training of new employees.

12. Solve on-site line shutdown problems and provide feedback and tracking to ensure production continuity.

More than 1.5 years of experience in DIP and electronic assembly process engineering.

2. Familiar with DIP core processes: plug-in, wave soldering, hand soldering, crimping, depaneling, three-proof coating, etc.

3. Be familiar with the analysis and improvement methods of common defects in DIP processes such as wave soldering and hand soldering.

4. Master common defect analysis methods and be familiar with industry standards.

5. Proficient in using CAD, CAM and MES systems, and able to understand PCB assembly drawings, BOM and mechanical drawings.

6. Familiar with FMEA, SPC, 8D and other quality tools.