Job responsibilities：

1. Responsible for the detection and repair of functional defects after the DIP plug-in or the PCBA board is completed, and analyze and repair the faulty board based on the functional test report (ICT, FCT, burning test, etc.), including but not limited to: open circuit, short circuit, component damage, parameter abnormality, program burning failure, power supply abnormality, signal failure and other functional problems;

2. Use multimeters, oscilloscopes, power supplies, signal generators, programmers and other tools to conduct voltage, current, waveform, continuity and other tests on the faulty board to accurately locate faulty components or circuit modules;

3. Replace or repair the confirmed defective components, and skillfully use tools such as electric soldering iron, solder extractor, and hot air gun to complete the disassembly and welding of plug-ins (such as transistors, electrolytic capacitors, relays, connectors, etc.) and some SMD components;

4. Conduct troubleshooting based on product specifications, circuit schematics, bit number diagrams and BOM lists, and be able to identify the basic structures of common analog and digital circuits (such as power circuits, amplifier circuits, logic circuits, etc.);

Retest the repaired PCB board to ensure that the function returns to normal and meets product quality and reliability standards;

5. Use anti-static tools and ESD protection equipment correctly to prevent secondary damage during maintenance;

Fill in the maintenance record form truthfully, record the failure phenomenon, cause analysis, replacement materials and processing results, and provide data support for quality traceability and defective analysis;

Assist the engineering and quality departments to provide feedback on batch and repetitive functional problems, put forward suggestions for improvement, and participate in the verification and closed-loop of functional problems during the trial production phase.

Job responsibilities：

1. Responsible for the formulation, optimization and continuous improvement of DIP (plug-in) production process, with the core goal of improving the first pass rate of assembly.

2. Prepare DIP related operating instructions (SOP), process parameter settings and FMEA analysis to ensure the accuracy and enforceability of process documents.

3. Monitor process parameters of wave soldering, hand soldering, crimping, depaneling, three-proof coating and other equipment to ensure process stability and consistency.

4. Analyze and solve yield problems in DIP production (such as continuous soldering, missing soldering, empty soldering, floating components, reverse polarity, tin beads, etc.).

5. Responsible for the process design and optimization of back-end assembly (testing, packaging, machine assembly, etc.).

6. Solve problems such as structural assembly, welding quality, and functional testing that arise during the assembly process.

7. Cooperate with new product introduction (NPI) to complete the A and B phase installation review and process feasibility assessment.

8. Collaborate with research and development (RD), quality (QA), production, equipment and other departments to promote product design for manufacturability (DFM).

9. Support the analysis and improvement of customer complaints and provide technical support from a process perspective.

10. Promote automation and lean production to improve production efficiency and product yield. Reduce material loss and repair rate, and control manufacturing costs.

11. Responsible for the promotion and implementation of process routes, management of key positions, training of multi-skilled workers, and skill training of new employees.

12. Solve on-site line shutdown problems and provide feedback and tracking to ensure production continuity.

Job responsibilities：

1. Responsible for the formulation, optimization and continuous improvement of SMT (Surface Mount Technology) production process.

2. Prepare SMT related operating instructions (SOP), process parameter settings and FMEA analysis.

3. Monitor the process parameters of reflow soldering, printing, SMT, AOI, SPI and other equipment to ensure process stability.

4. Analyze and solve yield problems in SMT production (such as virtual soldering, offset, bridging, etc.).

5. Responsible for the process design and optimization of back-end assembly (DIP, hand welding, testing, packaging, etc.).

6. Solve problems such as structural assembly, welding quality, and functional testing that arise during the assembly process.

7. Cooperate with new product introduction (NPI) to complete trial production verification and process feasibility assessment.

8. Collaborate with research and development (RD), quality (QA), production, equipment and other departments to promote product design for manufacturability (DFM).

9. Support the analysis and improvement of customer complaints and provide technical support from a process perspective.

10. Promote automation and lean production to improve production efficiency and product yield.

11. Reduce material loss and repair rate, and control manufacturing costs.

Job responsibilities：

1. Responsible for the process quality control and continuous improvement of electric vehicle electronic controls (controllers) and BMS (battery management system) products to ensure that the production process is stable and the quality meets standards;

2. Lead the analysis and processing of process quality abnormalities, use 5Why, fishbone diagram, FMEA and other tools to conduct root cause analysis, formulate and track corrective and preventive actions (CAPA), and promote closed-loop issues;

3. Participate in quality planning at the new product introduction (NPI) stage, identify critical quality control points (CTQ), output control plan (Control Plan) and PFMEA;

4. Lead the handling of customer complaints, prepare 8D reports, promote closed-loop issues, and reduce the rate of customer complaints in the market;

5. Monitor key quality indicators of the production process (first-time offline pass rate, repair rate, OQC defective rate, etc.), regularly output quality analysis reports, and promote process improvement;

6. Collaborate with IPQC, OQC, process, production and other departments to optimize inspection standards (SIP) and operating procedures to improve process control capabilities;

7. Promote the application of quality tools (SPC, MSA, CPK, etc.) to improve process capabilities and data-driven decision-making;

8. Participate in ISO9001/IATF16949 system audit to ensure the effective operation of the quality system.

Job responsibilities：

Responsible for the testing and verification of battery BMS for two-wheeled vehicles (electric bicycles, electric motorcycles) to ensure that products meet national standards, corporate standards and the market's stringent requirements for safety and performance. Main responsibilities include:

1. Functional testing: Lead the verification of BMS core functions, including voltage/current/temperature acquisition accuracy testing, overcharge/over-discharge/overcurrent/short-circuit protection function verification, relay control logic testing and single battery balancing function testing.

2. Communication test: Responsible for the stability and consistency test of the BMS communication protocol to ensure that CAN bus communication (in compliance with GB/T 27930 and other protocols) is reliable, the UDS diagnostic function is complete, and it can interact stably with the vehicle or charging equipment.

3. Reliability and environmental testing: Develop and implement high and low temperature cycle tests, heat and humidity tests, vibration and shock tests, salt spray tests, and long-term cycle charge and discharge life tests to comprehensively evaluate the environmental adaptability and durability of BMS.

4. Safety test: Execute strict electrical safety tests, including overvoltage/undervoltage/overtemperature protection response time test, insulation resistance test, thermal abuse test and fault simulation test, to ensure that BMS can protect the battery system in a timely and effective manner under abnormal conditions.

5. Test plan formulation: Independently formulate test plans and design test cases based on product requirements and national standards. Set up a test environment.

6. Collaboration and improvement: Work closely with hardware, software and product engineers to conduct root cause analysis on test failure samples, output professional test reports, and promote design optimization and problem closure.